Printed Circuit Board yog lub hauv paus ntawm cov khoom siv hluav taws xob, nws yog ib qho tseem ceeb heev rau koj cov khoom tuaj yeem ua haujlwm ruaj khov rau lub sijhawm ntev lossis tsis ua haujlwm.Raws li tus kws tshaj lij PCB thiab PCB los ua ke cov chaw tsim khoom, PCBFuture muab tus nqi siab ntawm cov khoom siv hluav taws xob zoo.
PCBFuture pib los ntawm PCB Fabrication lag luam, tom qab ntawd txuas mus rau PCB sib dhos thiab cov khoom siv khoom, tam sim no tau dhau los ua ib qho zoo tshaj plaws turnkey PCB los ua ke cov chaw tsim khoom.Peb ua ntau lub zog los nqis peev rau cov cuab yeej siv siab tshaj plaws rau kev siv thev naus laus zis zoo dua, ua kom zoo rau sab hauv kom zoo dua qub, txhawb kev ua haujlwm rau kev txawj ntse zoo dua.
| Txheej txheem | Yam khoom | Txheej Txheem Muaj Peev Xwm | |
| Cov ntaub ntawv hauv paus | Muaj peev xwm tsim tau | Txheej suav | 1-30 txheej |
| Hneev thiab twist | 0.75% tus qauv, 0.5% siab heev | ||
| Min.ua tiav PCB loj | 10 x 10 hli (0.4 x 0.4 ") | ||
| Max.ua tiav PCB loj | 530 x 1000 hli (20.9 x 47.24 ") | ||
| Multi-nias rau qhov muag tsis pom / faus vias | Multi-press Cycle≤3 zaug | ||
| Ua tiav board thickness | 0.3 ~ 7.0 hli (8 ~ 276mil) | ||
| Ua tiav board thickness kam rau ua | +/- 10% tus qauv, +/- 0.1mm siab heev | ||
| Nto tiav | HASL, Lead dawb HASL, Flash kub, ENIG, Hard kub plating, OSP, Immersion Tin, Immersion nyiaj, thiab lwm yam | ||
| Selective nto tiav | ENIG + Kub ntiv tes, Flash kub + Kub ntiv tes | ||
| Hom khoom | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide / Polyester, thiab lwm yam. | Kuj tseem tuaj yeem yuav cov ntaub ntawv raws li kev thov | |
| tooj liab ntawv ci | 1/3oz ~ 10oz | ||
| Prepreg Hom | FR4 Prepreg, LD-1080 (HDI) | 106, 1080, 2116, 7628, thiab lwm yam. | |
| Txhim khu kev kuaj | Peel zog | 7.8 N / cm | |
| Famability | 94v 0 | ||
| Ionic paug | ≤ 1g / cm² | ||
| Min.dielectric thickness | 0.075 hli (3mil) | ||
| Impedance kam rau ua | +/- 10%, min tuaj yeem tswj tau +/- 7% | ||
| Sab hauv txheej & txheej txheej Duab Hloov | Tshuab muaj peev xwm | Tshuab ntxhua khaub ncaws | Khoom thickness: 0.11 ~ 3.2mm (4.33mil ~ 126mil) |
| Khoom loj: min.228 x 228 hli (9 x 9 ") | |||
| Laminator, Exposer | Khoom thickness: 0.11 ~ 6.0mm (4.33 ~ 236mil) | ||
| Khoom loj: min 203 x 203mm (8 x 8 "), max. 609.6 x 1200mm (24 x 30") | |||
| Etching Kab | Khoom thickness: 0.11 ~ 6.0mm (4.33mil ~ 236mil) | ||
| Khoom loj: min.177 x 177 hli (7 x 7 ") | |||
| Sab hauv txheej txheej txheem muaj peev xwm | Min.sab hauv kab dav / qhov sib txawv | 0.075/0.075 hli (3/3mil) | |
| Min.sib nrug los ntawm qhov ntug mus rau conductive | 0.2 hli (8mil) | ||
| Min.puab txheej annular nplhaib | 0.1 hli (4mil) | ||
| Min.sab hauv txheej cais clearance | 0.25mm (10mil) tus qauv, 0.2mm (8mil) siab heev | ||
| Min.sib nrug los ntawm board ntug mus rau conductive | 0.2 hli (8mil) | ||
| Min.qhov dav dav ntawm tooj liab hauv av | 0.127 hli (5mil) | ||
| Unbalance tooj liab thickness rau puab core | H/1oz, 1/2oz | ||
| Max.tiav tooj liab thickness | 10 oz | ||
| Txheej txheej txheej txheem muaj peev xwm | Min.sab nrauv kab dav / qhov sib txawv | 0.075/0.075 hli (3/3mil) | |
| Min.qhov pad loj | 0.3 hli (12mil) | ||
| Txheej Txheem Muaj Peev Xwm | Max.qhov loj tenting | 5 x 3 hli (196.8 x 118mil) | |
| Max.tenting qhov loj | 4.5 hli (177.2mil) | ||
| Min.tenting av dav | 0.2 hli (8mil) | ||
| Min.annular nplhaib | 0.1 hli (4mil) | ||
| Min.BGA suab | 0.5 hli (20mil) | ||
| AOI | Tshuab muaj peev xwm | Orbotech SK-75 AOI | Khoom thickness: 0.05 ~ 6.0mm (2 ~ 236.2mil) |
| Khoom loj: max.597 ~ 597 hli (23.5 x 23.5 ") | |||
| Orbotech Ves Tshuab | Khoom thickness: 0.05 ~ 6.0mm (2 ~ 236.2mil) | ||
| Khoom loj: max.597 ~ 597 hli (23.5 x 23.5 ") | |||
| Drilling | Tshuab muaj peev xwm | MT-CNC2600 Laum tshuab | Khoom thickness: 0.11 ~ 6.0mm (4.33 ~ 236mil) |
| Khoom loj: max.470 ~ 660 hli (18.5 x 26 ") | |||
| Min.laum loj: 0.2mm (8mil) | |||
| Txheej Txheem Muaj Peev Xwm | Min.multi-ntaus xyaum me me | 0.55 hli (21.6mil) | |
| Max.nam piv (Tiav board loj VS Laum loj) | 12:01 Nws | ||
| Qhov qhov chaw kam rau ua (piv nrog CAD) | +/- 3mil | ||
| Counterbore qhov | PTH & NPTH, Sab saum toj kaum 130 °, Sab saum toj txoj kab uas hla <6.3mm | ||
| Min.sib nrug los ntawm qhov ntug mus rau conductive | 0.2 hli (8mil) | ||
| Max.xyaum me me | 6.5 hli (256mil) | ||
| Min.multi-ntaus qhov loj | 0.45 hli (17.7mil) | ||
| Qhov loj kam rau siab rau xovxwm haum | +/- 0.05 hli (+/- 2mil) | ||
| Min.PTH qhov loj me kam rau ua | +/- 0.15mm (+/-6mil) | ||
| Min.NPTH slot size kam rau ua | +/- 2mm (+/-78.7mil) | ||
| Min.nrug ntawm qhov ntug mus rau conductive (dig muag vias) | 0.23 hli (9mil) | ||
| Min.laser laum loj | 0.1 hli (+/- 4mil) | ||
| Countersink qhov lub kaum sab xis & Txoj kab uas hla | Sab saum toj 82,90,120 ° | ||
| Cov txheej txheem ntub dej | Tshuab muaj peev xwm | Vaj Huam Sib Luag & Pattern plating kab | Khoom thickness: 0.2 ~ 7.0mm (8 ~ 276mil) |
| Khoom loj: max.610 x 762 hli (24 x 30 ") | |||
| Deburring Maching | Khoom thickness: 0.2 ~ 7.0mm (8 ~ 276mil) | ||
| Khoom loj: min.203 x 203 hli (8 "x 8") | |||
| Desmear Kab | Khoom thickness: 0.2mm ~ 7.0mm (8 ~ 276mil) | ||
| Khoom loj: max.610 x 762 hli (24 x 30 ") | |||
| Tin plating kab | Khoom thickness: 0.2 ~ 3.2mm (8 ~ 126mil) | ||
| Khoom loj: max.610 x 762 hli (24 x 30 ") | |||
| Txheej Txheem Muaj Peev Xwm | Qhov phab ntsa tooj liab thickness | nruab nrab 25um (1mil) tus qauv | |
| Ua tiav tooj liab thickness | ≥18um (0.7mil) | ||
| Min kab dav rau etching cim | 0.2 hli (8mil)) | ||
| Max.finished tooj liab hnyav rau sab hauv & txheej txheej | 7oz ib | ||
| Txawv tooj liab thickness | H/1oz, 1/2oz | ||
| Solder Mask & Silkscreen | Tshuab muaj peev xwm | Tshuab ntxhua khaub ncaws | Khoom thickness: 0.5 ~ 7.0mm (20 ~ 276mil) |
| Khoom loj: min.228 x 228 hli (9 x 9 ") | |||
| Tso tawm | Khoom thickness: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Khoom loj: max.635 x 813 hli (25 x 32 ") | |||
| Txhim kho tshuab | Khoom thickness: 0.11 ~ 7.0mm (4.3 ~ 276mil) | ||
| Khoom loj: min.101 x 127 hli (4 x 5 ") | |||
| Xim | Solder mask xim | Ntsuab, matte ntsuab, daj, dub, xiav, liab, dawb | |
| Silkscreen xim | Dawb, daj, dub, xiav | ||
| Solder Mask Capability | Min.solder daim npog qhov ncauj qhib | 0.05 hli (2mil) | |
| Max.ntsaws ntawm qhov loj | 0.65 hli (25.6mil) | ||
| Min.dav rau kab kev them nyiaj los ntawm S / M | 0.05 hli (2mil) | ||
| Min.solder mask Legends dav | 0.2mm (8mil) txheem, 0.17mm (7mil) siab heev | ||
| Min.solder daim npog qhov ncauj thickness | 10um (0.4mil) | ||
| Solder mask thickness rau ntawm tenting | 10um (0.4mil) | ||
| Min.carbon roj kab dav / nrug | 0.25/0.35 hli (10/14mil) | ||
| Min.tracer ntawm carbon | 0.06 hli (2.5mil) | ||
| Min.carbon oil kab kab | 0.3 hli (12mil)) | ||
| Min.sib nrug los ntawm cov qauv carbon mus rau cov ntaub qhwv | 0.25 hli (10mil) | ||
| Min.dav rau peelable daim npog qhov ncauj kab / ncoo | 0.15 hli (6mil) | ||
| Min.solder mask choj dav | 0.1 hli (4mil)) | ||
| Solder Mask Hardness | 6H | ||
| Peelable Mask Capability | Min.sib nrug los ntawm peelable daim npog qhov ncauj rau pad | 0.3 hli (12mil)) | |
| Max.loj rau daim npog ntsej muag lub tsev pheebsuab qhov (Los ntawm kev tshuaj ntsuam luam ntawv) | 2 hli (7.8mil) | ||
| Max.loj rau daim npog ntsej muag lub tsev pheebsuab qhov (Los ntawm txhuas luam ntawv) | 4.5mm ib | ||
| Peelable daim npog qhov ncauj thickness | 0.2 ~ 0.5 hli (8 ~ 20mil) | ||
| Silkscreen Muaj peev xwm | Min.silkscreen kab dav | 0.11 hli (4.5mil) | |
| Min.silkscreen kab qhov siab | 0.58 hli (23mil) | ||
| Min.sib nrug los ntawm lus dab neeg mus rau hauv ncoo | 0.17 hli (7mil) | ||
| Nto tiav | Nto Finish Capability | Max.kub ntiv tes ntev | 50mm (2 ") |
| ENIG | 3 ~ 5um (0.11 ~ 197mil) npib tsib xee, 0.025 ~ 0.1um (0.001 ~ 0.004mil) kub | ||
| ntiv tes kub | 3 ~ 5um (0.11 ~ 197mil) npib tsib xee, 0.25 ~ 1.5um (0.01 ~ 0.059mil) kub | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL tshuab | Khoom thickness: 0.6 ~ 4.0mm (23.6 ~ 157mil) | ||
| Khoom loj: 127 x 127mm ~ 508 x 635mm (5 x 5 "~ 20 x 25") | |||
| Hard kub plating | 1-5 ua" | ||
| Immersion Tin | 0.8 ~ 1.5um (0.03 ~ 0.059mil) Tin | ||
| Immersion Nyiaj | 0.1 ~ 0.3um (0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um (0.008 ~ 0.02mil) | ||
| E-Test | Tshuab muaj peev xwm | Flying sojntsuam tester | Khoom thickness: 0.4 ~ 6.0mm (15.7 ~ 236mil) |
| Khoom loj: max.498 x 597 hli (19.6 ~ 23.5 ") | |||
| Min.qhov sib txawv ntawm qhov ntsuas ntsuas mus rau board ntug | 0.5 hli (20mil) | ||
| Min.conductive kuj | 5 Ω | ||
| Max.rwb thaiv tsev tsis kam | 250 mΩ | ||
| Max.xeem voltage | 500 V | ||
| Min.kuaj pad loj | 0.15 hli (6mil)) | ||
| Min.test pad rau pad spacing | 0.25 hli (10mil) | ||
| Max.kuaj tam sim no | 200 mA | ||
| Profileing | Tshuab muaj peev xwm | Hom ntawv profile | NC routing, V-txiav, qhov tabs, stamp qhov |
| NC routing tshuab | Khoom thickness: 0.05 ~ 7.0mm (2 ~ 276mil) | ||
| Khoom loj: max.546 x 648 hli (21.5 x 25.5 ") | |||
| V-txiav tshuab | Khoom thickness: 0.6 ~ 3.0mm (23.6 ~ 118mil) | ||
| Max khoom dav rau V-txiav: 457mm (18 ") | |||
| Txheej Txheem Muaj Peev Xwm | Min.routing me ntsis loj | 0.6 hli (23.6mil) | |
| Min.qhia qhov kam rau ua | +/- 0.1 hli (+/- 4mil) | ||
| V-txiav lub kaum sab xis hom | 20 °, 30 °, 45 °, 60 ° | ||
| V-txiav lub kaum sab xis | +/-5° | ||
| V-txiav sau npe kam rau ua | +/- 0.1 hli (+/- 4mil) | ||
| Min.kub ntiv tes sib nrug | +/- 0.15mm (+/-6mil) | ||
| Bevelling kaum tolerance | +/-5° | ||
| Bevelling nyob twj ywm thickness kam rau ua | +/- 0.127 hli (+/- 5mil) | ||
| Min.sab hauv vojvoog | 0.4 hli (15.7mil) | ||
| Min.sib nrug los ntawm conductive mus rau daim ntawv | 0.2 hli (8mil) | ||
| Countersink / Counterbore tob kam rau ua | +/- 0.1 hli (+/- 4mil) | ||